Polyethylene tape core instead of cardboard
3M™ 5413 polyimide film tape has a silicone adhesive. Made for high temperature applications. Usage temperatures range from -73 °C to 260 °C
3M 5413 polyimide film tape is used to protect gold components on printed circuit boards during wave and dip soldering, as it has a release surface that is useful when fabricating cured components at high temperatures
DuPont™ Kapton(R) polyimide film does not melt at high temperatures; therefore, it offers an excellent release surface even at high temperatures.
It retains its dimensions even at high temperatures; this increases productivity as it reduces the need for repeat operations.
It is flame-retardant, resistant to chemicals and radiation, protects surfaces and reduces component replacement costs
The ability to use silicone adhesive even at high temperatures reduces adhesive melt, eliminating the need for cleaning and thus increasing productivity.