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Polyimide Film Tape 3M 5413 3/4 inch x 36 yd 2.7 mil

SKU: TS0106

3M Polyimide Film Tape 5413 Amber, 2.7 mil (0.07 mm) polyimide film with a silicone adhesive, flame retardant, chemical and radiation resistant.
Protect circuit boards when soldering with this high temperature tape.
Resists temperatures extremes from -100°F to 500°F.
Won’t soften at higher temperatures.
Flame, chemical and radiation resistant.

Discounted Price

65,82 

Regular Price

73,13 
 

Per piece/roll (excl. VAT)

3M Polyimide Film Tape 5413 Amber, 2.7 mil (0.07 mm) polyimide film with a silicone adhesive, flame retardant, chemical and radiation resistant.
Protect circuit boards when soldering with this high temperature tape.
Resists temperatures extremes from -100°F to 500°F.
Won’t soften at higher temperatures.
Flame, chemical and radiation resistant.

3M 5413 polyimide film tape is used to protect gold components on printed circuit boards during wave and dip soldering, as it has a release surface that is useful when fabricating cured components at high temperatures

DuPont™ Kapton(R) polyimide film does not melt at high temperatures; therefore, it offers an excellent release surface even at high temperatures.
It retains its dimensions even at high temperatures; this increases productivity as it reduces the need for repeat operations.
It is flame-retardant, resistant to chemicals and radiation, protects surfaces and reduces component replacement costs
The ability to use silicone adhesive even at high temperatures reduces adhesive melt, eliminating the need for cleaning and thus increasing productivity.

SKU TS0106
GTIN, UPC, EAN o ISBN 00021200161735
Manufacturer 3M
Manufacturer Code 7000029143
Weight 1 kg
Color
Width (mm) 19
Length (m) 33
Thickness (mm) 7
Diameter (mm)
Volume (liters)
Notes 3M Polyimide Film Tape 5413, 2.7 mil (0.07 mm) polyimide film with a silicone adhesive, flame retardant, chemical and radiation resistant. Used as mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process, release surface in fabrication of parts cured at elevated temperatures. Benefits: At room temperature, the properties of Kapton® and polyimide polyester films are similar, however, as the temperature increases or decreases, the properties of the Kapton® film are less affected than polyester Kapton® film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures RoHS compliant Mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process Release surface in fabrication of parts cured at elevated temperatures

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