3M™ Electrically Conductive Tapes 5113 Series
3M material science and EMI/RFI management expertise brings you a new conductive adhesive chemistry for today’s demanding applications.
Introducing a new portfolio offering electrically conductive tapes using an innovative conductive polyolefin adhesive and conductive particle matrix for enhanced performance. 3M™ Electrically Conductive Tape 5113 Series features XYZ-axis conductivity with a conductive matrix carrier and 3M’s innovative new conductive polyolefin pressure sensitive adhesive (PSA). The combination of Ni/Cu/ Ni-coated conductive woven fabric carrier and proprietary conductive polyolefin adhesive filled with Ni-coated graphite particles offers high adhesion, low resistance, long shelf life, improved performance in humid environments, and great grounding performance to a broad range of substrates and surface types. This product series has a four-year shelf-life that is stable in humid conditions, made possible by a moisture resistant polyolefin adhesive chemistry. Market Segments:
These tapes provide robust protection against EMI in a range of market segments:
• General industrial electronics • Aerospace and defense electronics • Appliances, automotive and IoT devices • Communications infrastructure • Medical equipment • More
Introducing a new go-to double-sided fabric tape for your complex grounding applications.
3M™ Electrically Conductive Double-Sided Tape 5113DFT is an XYZ-axis double-sided fabric tape (DFT) consisting of a conductive matrix carrier and 3M’s innovative new conductive polyolefin pressure sensitive adhesive (PSA). Based on 3M’s new proprietary polyolefin conductive adhesive, 3M tape 5113DFT provides premium performance including high adhesion, low electrical resistance, long shelf life, improved temperature resistance and excellent grounding and shielding performance. The table below illustrates key performance properties of 3M™ Electrically Conductive Double-Sided Tape 5113DFT-50 compared to a similar 3M high performing double-sided tape.
